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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-304-6000 Item Description: Microcircuit Memory | 5962 | 013046000 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
55898-90261 | 2 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 38.0 MILLIMETERS MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 20 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
ADAT | BODY WIDTH | 14.2 MILLIMETERS MAXIMUM |
ADAU | BODY HEIGHT | 5.2 MILLIMETERS MAXIMUM |
558 002 | 558-005-003 | 558-0101-803 | 558-00HS500K |
558-0101-001 | 558-0101-007 | 558-010 | 558-0101-803 |
558-0050-015 | 558-0101-003 | 558-00-030200024 | 558-0001 |
558-0050-015 | 558-0101-001 | 558 010 58 06 | 558-0050-015 |
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