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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-411-0312 Item Description: Semiconductor Devic | 5961 | 014110312 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
2037as362-01 | 5 | 2 | 7 |
MRC | Criteria | Characteristic |
---|---|---|
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR |
ABMK | OVERALL WIDTH | 2.5 MILLIMETERS MAXIMUM |
ABKW | OVERALL HEIGHT | 1.1 MILLIMETERS MAXIMUM |
ABBH | INCLOSURE MATERIAL | PLASTIC |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-143 |
ABHP | OVERALL LENGTH | 3.0 MILLIMETERS MAXIMUM |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 70.0 MAXIMUM REVERSE VOLTAGE, PEAK ALL SEMICONDUCTOR DEVICE DIODE |
TTQY | TERMINAL TYPE AND QUANTITY | 4 PRINTED CIRCUIT |
CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 AMPERES MAXIMUM FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE ALL SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | TERMINAL |
TEST | TEST DATA DOCUMENT | 30003-2037AS362 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE |
203-0004-050 | 203-00-6905-1 | 203-00006-01 | 203-0004-002 |
203-000-001 | 203-000-001 | 203-0002-019 | 203-0001 |
203-0002-019 | 203-0001-01 | 203-00032-001 | 203 00 085 |
203-0002-019 | 203 00 084 | 203-000007-999 | 203-000-001 |
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