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| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND LOW POWER AND SCHOTTKY AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 BUFFER, NAND |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | TO-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEQ | TIME RATING PER CHACTERISTIC | 24.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 24.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ZZZK | SPECIFICATION/STANDARD DATA | 30377-23104 MANUFACTURERS SOURCE CONTROL |
| 231-0006 | 231-00004 | 231-0008 | 231-0008 |
| 231-0009-000 | 231-0006 | 231-00007 | 231-0001-1 |
| 231-001 | 231-0006 | 231-0001-1 | 231-0009-000 |
| 231-0003 | 231-0 | 231-0004 | 231-0006 |
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