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| MRC | Criteria | Characteristic |
|---|---|---|
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND W/CLEAR AND W/CLOCK |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ADAT | BODY WIDTH | 0.285 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZEQ | TIME RATING PER CHACTERISTIC | 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 16.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 FLIP-FLOP, D-TYPE |
| MPD 12 S2 P2C2 | MPD 100R-109 | MPD-100-002 | MPD-1 |
| MPD 100IEC-017 | MPD-1110J | MPD 100 003 | MPD-1110J |
| MPD-100R-070 | MPD-1506 | MPD-1506-EE10U9 | MPD 10K1PC |
| MPD-1110J | MPD 10K1PC | MPD-09150C | MPD 100IEC |
 |
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