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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-138-5257 Item Description: Microcircuit Digita | 5962 | 001385257 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | U | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Sg8112 | 3 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.160 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 60.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | DUAL 5 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 GATE, LOGIC, PULSE SHAPING DELAY |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-85 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 15.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 13499-351-7307 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
SG8-9138 | SG800 | SG8022 | SG80-30 |
SG80-34 | SG8-9138 | SG8002CAMPBLANK | SG8022 |
SG80-25 | SG8002DCPTCI02 048MHZ | SG8023 | SG8-250-81 |
SG80-17 | SG8002JCMPBLANK | SG8002CA62-5000MPCBB | SG8002CA33-000MPCCB |
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