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MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL |
CTRK | TRANSFER RATIO | 300.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER AND 2.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 400.0 NOMINAL REACH THROUGH VOLTAGE |
TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN |
ADAV | OVERALL DIAMETER | 25.00 MILLIMETERS MINIMUM AND 26.00 MILLIMETERS MAXIMUM |
AKPV | MOUNTING FACILITY QUANTITY | 2 |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
AXGY | MOUNTING METHOD | UNTHREADED HOLE |
ABMK | OVERALL WIDTH | 25.00 MILLIMETERS MINIMUM AND 26.00 MILLIMETERS MAXIMUM |
ASCQ | INTERNAL JUNCTION CONFIGURATION | NPN |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-3 |
ABKW | OVERALL HEIGHT | 19.32 MILLIMETERS MINIMUM AND 22.02 MILLIMETERS MAXIMUM |
CTRD | POWER RATING PER CHARACTERISTIC | 175.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQX | CURRENT RATING PER CHARACTERISTIC | 15.00 AMPERES NOMINAL FORWARD CURRENT, AVERAGE |
ABHP | OVERALL LENGTH | 38.50 MILLIMETERS MINIMUM AND 39.30 MILLIMETERS MAXIMUM |
BU9431 | BU90-8CP-P4 | BU931ZD2-8188 | BU931ZSM |
BU9255FSE2 | BU9431-D1-E2 | BU90-8CP-P4 | BU911 |
BU941ZTFI | BU9204CFE2 | BU9005X00E2 | BU9005 X00A2 |
BU911 | BU931SM | BU931TFI | BU932 |
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