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| MRC | Criteria | Characteristic |
|---|---|---|
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | NOT ESTABLISHED |
| ABJT | TERMINAL LENGTH | 0.020 INCHES NOMINAL |
| ADAQ | BODY LENGTH | 0.126 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.063 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.059 INCHES NOMINAL |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS |
| CQBQ | CAPACITANCE VALUE PER SECTION | 100000.000 PICOFARADS SINGLE SECTION |
| CQFB | VOLTAGE TEMP LIMITS PER SECTION IN PERCENT CAPACITANCE CHANGE | -15.0/+15.0 WITHOUT VOLTAGE APPLIED SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -10.00/+10.00 PERCENT SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES SILVER |
| CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 2.500 |
| CWSG | TERMINAL SURFACE TREATMENT | SILVER |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| 11C-7-37 | 11C-L | 11C00002 | 11C0014 |
| 11C-50-3-4 | 11C-1750-15A4NM AS | 11C00002 | 11C-50-3-4 |
| 11C-7-30 | 11C-8-37 | 11C0060 | 11C0063 |
| 11C-9-54 | 11C-8-50 | 11C0014 | 11C-020028 |
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