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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-478-7616 Item Description: Semiconductor Devic | 5961 | 014787616 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Dmj2778-99 | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CTRG | CAPACITANCE RATING IN PICOFARADS | 0.05 MINIMUM AND 0.06 MAXIMUM |
ABMK | OVERALL WIDTH | 0.002 MILLIMETERS MAXIMUM |
ABHP | OVERALL LENGTH | 0.036 MILLIMETERS MAXIMUM |
AKPV | MOUNTING FACILITY QUANTITY | 1 |
ABKW | OVERALL HEIGHT | 0.010 MILLIMETERS MAXIMUM |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 9.0 MINIMUM BREAKDOWN VOLTAGE, DC |
CTRD | POWER RATING PER CHARACTERISTIC | 300.0 MILLIWATTS MAXIMUM FORWARD POWER DISSIPATION, AVERAGE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
AXGY | MOUNTING METHOD | PRESS FIT |
ABJT | TERMINAL LENGTH | 0.013 MILLIMETERS MAXIMUM |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 550.00 MILLIAMPERES MINIMUM FORWARD CURRENT, DC AND 700.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
ABBH | INCLOSURE MATERIAL | GLASS |
DMJ2210-253 | DMJ2246-000 | DMJ2209-000 | DMJ2208-253 |
DMJ2088-255 | DMJ2088 | DMJ2209-253 | DMJ2208-000 |
DMJ2209-223 | DMJ2092-252 | DMJ2093-000 | DMJ2093-222 |
DMJ2208-223 | DMJ2092-222 | DMJ2210-223 | DMJ2210-000 |
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