Part SM-A-838094-1 With Different Manufacturers

SM-A-838094-1

Joint Electronics Type Designation

Paper Tabulating Ma

NSN: 7530011064725

CAGE Code: 80058

RFQ

SM-A-838094-1

Philips Semiconductors Ltd

Microcircuit Memory

NSN: 5962011573651

CAGE Code: 18324

RFQ

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SM-A-838094-1 Microcircuit Memory by Siemens Ag with NSN 5962-01-157-3651 - Buy Now!

Mfg Part Number: SM-A-838094-1

Alternate P/N:SMA8380941

Manufacturer: Siemens Ag

NSN :5962-01-157-3651

Item Name : microcircuit memory

FSC :5962 Microcircuits Electronic

Thank you for your interest in SM-A-838094-1 under FSC5962 Microcircuits Electronic NSN part on ASAP Global Supplies. Microcircuit Memory is listed under the part number SM-A-838094-1, and it is manufactured by Siemens Ag. This item, alongside our other listed NSN parts, is available for purchase today through our website. If you are interested in this particular item, we invite you to fill out and submit the Request for Quote form as provided through our website. Once received, a member of our staff will review and respond in 15 minutes or less to provide a personalized quote based on your individual needs.

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NSN Information for Part Number SM-A-838094-1 with NSN 5962-01-157-3651, 5962011573651

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-157-3651 Item Description: Microcircuit Memory	5962	011573651		N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
				A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
Sm-A-838094-1	3	2	3

Characteristics Data of NSN 5962-01-157-3651, 5962011573651

MRC	Criteria	Characteristic
MEMORY	ADAQ	BODY LENGTH1 380 INCHES MINIMUM AND 1 430 INCHES MAXIMUM
MEMORY	ADAT	BODY WIDTH0 570 INCHES MINIMUM AND 0 610 INCHES MAXIMUM
MEMORY	ADAU	BODY HEIGHT0 080 INCHES MINIMUM AND 0 120 INCHES MAXIMUM
MEMORY	AFGA	OPERATING TEMP RANGE-55 085 0 DEG CELSIUS
MEMORY	AFJQ	STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS
MEMORY	AGAV	END ITEM IDENTIFICATIONCENTRAL OFFICE TYPE ANTTC-39
MEMORY	CBBL	FEATURES PROVIDEDHERMETICALLY SEALED AND BIPOLAR AND WENABLE AND WOPEN COLLECTOR AND SCHOTTKY
MEMORY	CQSJ	INCLOSURE MATERIALCERAMIC
MEMORY	CQSZ	INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY	CQWX	OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
MEMORY	CQZP	INPUT CIRCUIT PATTERN17 INPUT
MEMORY	CRHL	BIT QUANTITY576
MEMORY	CSWJ	WORD QUANTITY64
MEMORY	CWSG	TERMINAL SURFACE TREATMENTSOLDER
MEMORY	CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC7 0 VOLTS MAXIMUM POWER SOURCE
MEMORY	CZEQ	TIME RATING PER CHACTERISTIC80 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT
MEMORY	CZER	MEMORY DEVICE TYPERAM
MEMORY	TEST	TEST DATA DOCUMENT80063-SM-A-838094 DRAWING THIS IS THE BASIC GOVERNING DRAWING SUCH AS A CONTRACTOR DRAWING ORIGINAL EQUIPMENT MANUFACTURER DRAWING ETC EXCLUDES ANY SPECIFICATION STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING
MEMORY	TTQY	TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT

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