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MRC | Criteria | Characteristic |
---|---|---|
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
CQZP | INPUT CIRCUIT PATTERN | HEX 1 INPUT |
AEHX | MAXIMUM POWER DISSIPATION RATING | 400.0 MILLIWATTS |
ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 18.0 VOLTS MAXIMUM POWER SOURCE |
ADAQ | BODY LENGTH | 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CSSL | DESIGN FUNCTION AND QUANTITY | 6 BUFFER, INVERTING |
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