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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-099-8208 Item Description: Microcircuit Memory | 5962 | 010998208 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Mm5353-1d 883b | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND W/OPEN COLLECTOR AND 3-STATE OUTPUT |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CRHL | (NON-CORE DATA) BIT QUANTITY | 4096 |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CSWJ | (NON-CORE DATA) WORD QUANTITY | 1024 |
ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 11627-21008 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
ADAQ | BODY LENGTH | 0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM |
MM5-16533 | MM5-16533 | MM5-22H | MM5-1546 |
MM5-14N2 | MM5 1703 | MM5-11 5-16 | MM5-22PD09SL-GDF50 |
MM5-22PD09S25GDF-50 | MM5-22PD09SL-GDF50 | MM5-11 5-16 | MM5-14N |
MM5-14N2 | MM5-1572-1 | MM5-22PD09SGDF-50 | MM5-1572-1 |
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