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| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.105 INCHES NOMINAL |
| AFGA | OPERATING TEMP RANGE | -40.0 TO 85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND LOW POWER AND W/CLOCK |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MODULATOR |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| HC1-284-5 ITEM 9 | HC1-1-4-20X24 | HC1-284-5 ITEM 7 | HC1-1024-9 |
| HC1 284 5 ITEM 8 | HC1-10-32X8 | HC1 115VDC | HC1-252-15 |
| HC1-1 2FC | HC1-2FN | HC1-284-1ITEM3 | HC1-10-32X8 |
| HC1-1 2-13X24 | HC1-01 | HC1-1 2FW | HC1-252-12-23 |
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