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| MRC | Criteria | Characteristic |
|---|---|---|
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH VOLTAGE AND 3-STATE OUTPUT |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| ADAU | BODY HEIGHT | 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
| AGAV | III END ITEM IDENTIFICATION | 5820-01-102-3921 80058 |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | MO-001-AC JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 20.5 VOLTS MAXIMUM POWER SOURCE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 SELECTOR, DATA, MULTIPLEXER, TWO TO ONE LINE |
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