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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-00-469-8107 Item Description: Semiconductor Devic | 5961 | 004698107 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Ses-363 | 2 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABKW | OVERALL HEIGHT | 0.330 INCHES MINIMUM AND 0.505 INCHES MAXIMUM |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CCDG | OVERALL WIDTH ACROSS FLATS | 0.544 INCHES MINIMUM AND 0.562 INCHES MAXIMUM |
CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS CASE |
FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |
TTQY | TERMINAL TYPE AND QUANTITY | 1 SOLDER STUD AND 1 TAB, SOLDER LUG |
SES-307 | SES 334 | SES-157 | SES 334 |
SES-114-113TG1 | SES-114-113TG1 | SES-209 | SES-307 |
SES-12D-500 | SES 1108 | SES-307 | SES 334 |
SES 1108 | SES-138 | SES-114-113TG1 | SES-12-100 |
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