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MRC | Criteria | Characteristic |
---|---|---|
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.575 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | BURN IN AND HIGH PERFORMANCE |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
QD816A | QD8216 | QD800 | QD8155H 2 |
QD802 | QD818B | QD823 | QD802A |
QD8155H 2 | QD8203-1 | QD80287-08 | QD811 |
QD8237A-5 | QD823 | QD80104 | QD8237A-5 |
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