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MRC | Criteria | Characteristic |
---|---|---|
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND DYNAMIC AND W/STROBE AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
ADAT | BODY WIDTH | 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CZER | MEMORY DEVICE TYPE | ROM |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
AFGA | OPERATING TEMP RANGE | 0.0 TO 70.0 DEG CELSIUS |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.25 WATTS |
CRHL | (NON-CORE DATA) BIT QUANTITY | 4096 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 25.0 VOLTS MAXIMUM POWER SOURCE |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
ADAQ | BODY LENGTH | 0.780 INCHES MINIMUM AND 0.820 INCHES MAXIMUM |
TEST | TEST DATA DOCUMENT | 21101-49A0295 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
AFJQ | STORAGE TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
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