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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-330-0699 Item Description: Microcircuit Memory | 5962 | 013300699 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
7544195p501 | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.074 INCHES MINIMUM AND 0.086 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HIGH PERFORMANCE AND HIGH SPEED |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
754-0008-000 | 754-00146-01 | 754-00161-01 | 754-0008-000 |
754-00162-01 | 754-0003-000 | 754.001 | 754-0008-000 |
754-00162-01 | 754-001 | 754-00146-01 | 754-0004-000 |
754-0008-000 | 754-0007-000 | 754-0004-000 | 754 00146 01 |
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