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MRC | Criteria | Characteristic |
---|---|---|
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | STATIC OPERATION AND MONOLITHIC AND BURN IN AND ELECTROSTATIC SENSITIVE |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZER | MEMORY DEVICE TYPE | RAM |
ADAU | BODY HEIGHT | 0.210 INCHES NOMINAL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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