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MRC | Criteria | Characteristic |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
AFGA | OPERATING TEMP RANGE | 0.0 TO 70.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HIGH FREQUENCY AND HIGH PERFORMANCE AND LOW POWER |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
TTQY | TERMINAL TYPE AND QUANTITY | 68 LEADLESS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
HD6-256H | HD6-010H | HD6-269H | HD6-256H |
HD6-008H | HD6-258H | HD6-269H | HD6-010H |
HD6-258H | HD6-270H | HD6-112H | HD6-111H |
HD6-1600S-5S | HD6-255H | HD6-099HA | HD6-253H |
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