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MRC | Criteria | Characteristic |
---|---|---|
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CBBL | FEATURES PROVIDED | MONOLITHIC AND 3-STATE OUTPUT AND W/INHIBIT |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CZEQ | TIME RATING PER CHACTERISTIC | 280.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 280.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
ADAU | BODY HEIGHT | 0.185 INCHES NOMINAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 SELECTOR, DATA |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.5 VOLTS MAXIMUM POWER SOURCE |
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