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MRC | Criteria | Characteristic |
---|---|---|
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
AXGY | MOUNTING METHOD | TERMINAL |
ABBH | INCLOSURE MATERIAL | GLASS |
D02-14 | D02-22 | D02-007763 | D02-020-2022C |
D02-19 | D02-19B | D02-007763 | D02-14 |
D02-020-2022A | D02-0002-105 | D02-0002-105 | D02-22-22P-10000 |
D02-08N-A-03-252 8.132 IN.DIA | D02-16 | D02 14 | D02-020-2022B |
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