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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-421-1336 Item Description: Microcircuit Memory | 5962 | 014211336 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Mb8464-15cv-W-Sc | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
AEHX | MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER |
CZEQ | TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
CRHL | (NON-CORE DATA) BIT QUANTITY | 65536 |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
CZER | MEMORY DEVICE TYPE | RAM |
MB800-120 | MB805-10 | MB8017 | MB8 1 |
MB8010 | MB8017 | MB8018 | MB8018 |
MB8010 | MB800-0-100-200KL1 | MB800-0-100-200KL1 | MB800261 |
MB8010 | MB800-0-100-200KL1 | MB8010 | MB800-0-100-200KL1 |
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