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MRC | Criteria | Characteristic |
---|---|---|
ABKW | III OVERALL HEIGHT | 0.330 INCHES NOMINAL |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
ABMK | III OVERALL WIDTH | 0.300 INCHES NOMINAL |
CSSL | DESIGN FUNCTION AND QUANTITY | 6 BUFFER, NONINVERTING |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 3.0 VOLTS MINIMUM INPUT AND 18.0 VOLTS MAXIMUM INPUT |
CQZP | INPUT CIRCUIT PATTERN | HEX 1 INPUT |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | CMOS HEX NON-INVERTING BUFFER/CONVERTER |
FEAT | SPECIAL FEATURES | APPLICATIONS - CMOS TO DTL/TTL HEX CONVERTER; CMOS CURRENT SINK OR SOURCE DRIVER; CMOS HIGH-TO-LOW LOGIC LEVEL CONVERTER |
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