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MRC | Criteria | Characteristic |
---|---|---|
CSWJ | (NON-CORE DATA) WORD QUANTITY | 256 |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND POSITIVE OUTPUTS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-6 MIL-M-38510 |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
AGAV | III END ITEM IDENTIFICATION | TELETYPEWRITER SET,AN/UGC-129(V) |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | ROM |
CRHL | (NON-CORE DATA) BIT QUANTITY | 1024 |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.000 MILLIWATTS |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
ADAQ | BODY LENGTH | 0.960 INCHES MAXIMUM |
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