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| MRC | Criteria | Characteristic |
|---|---|---|
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.259 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 17.0 MILLIWATTS |
| ABMK | III OVERALL WIDTH | 0.755 INCHES NOMINAL |
| ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.259 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.051 INCHES MINIMUM AND 0.059 INCHES MAXIMUM |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 GATE, NAND |
| 930-001 | 930-0003-00 | 930 00 | 930-00068-000 |
| 930-0006-00 | 930-001 | 930-00067-000 | 930-00069-000 |
| 930-001B03 | 930-0007-00 | 930-00058-000 | 930-00025-001 |
| 930-0007-00 | 930-0011-00 | 930-001B01 | 930-001B04 |
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