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MRC | Criteria | Characteristic |
---|---|---|
CSSL | DESIGN FUNCTION AND QUANTITY | 2 GATE, NAND BUFFER |
AFGA | OPERATING TEMP RANGE | 0.0 TO 70.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND HIGH SPEED AND W/TOTEM POLE OUTPUT |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
ADAT | BODY WIDTH | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CZEQ | TIME RATING PER CHACTERISTIC | 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 05869-717129 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
AEHX | MAXIMUM POWER DISSIPATION RATING | 52.0 MILLIWATTS |
ADAQ | BODY LENGTH | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
717-001614 | 717-00-28 | 717-001 | 717-000616 |
717-0001 | 717-001 | 717-001564 | 717-002 |
717-002 | 717-00-63 | 717-000814 | 717-002 |
717-001168 | 717-001 | 717-000814 | 717-002-008 |
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