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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-00-160-1805 Item Description: Semiconductor Devic | 5961 | 001601805 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | G | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
10658352 | 2 | 2 | 1 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL ALL SEMICONDUCTOR DEVICE DIODE |
ABHP | OVERALL LENGTH | 0.735 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.765 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
ADAV | OVERALL DIAMETER | 0.215 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.220 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
AFZC | FUNCTION FOR WHICH DESIGNED | MICROWAVE AND MIXER |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT ALL SEMICONDUCTOR DEVICE DIODE |
ASCQ | INTERNAL JUNCTION CONFIGURATION | PN ALL SEMICONDUCTOR DEVICE DIODE |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
ASKA | COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
CBBL | FEATURES PROVIDED | BURN IN |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC ALL SEMICONDUCTOR DEVICE DIODE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE |
FEAT | SPECIAL FEATURES | TWO OF THE FOUR DIODES WILL BE FORWARD DIODES AND TWO WILL BE REVERSE DIODES |
PRMT | III PRECIOUS MATERIAL | GOLD |
TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN ALL SEMICONDUCTOR DEVICE DIODE |
ZZZK | SPECIFICATION/STANDARD DATA | 18876-10658352 MANUFACTURERS SOURCE CONTROL |
106-00001-0015 | 106-000-280 | 106 000 023 | 106-000-003 |
106-000-25 | 106-000-280 | 106-0-0366 | 106-000-WHT |
106-000-280 | 106-000-WHT | 106-000-280 | 106-000-003 |
106 000 08GALZNC | 106-000-25 | 106-000-255 | 106-000-003 |
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