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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-00-170-2520 Item Description: Semiconductor Devic | 5961 | 001702520 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
D5880bm | 2 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | CERAMIC ALL SEMICONDUCTOR DEVICE DIODE |
ABHP | OVERALL LENGTH | 0.732 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.732 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.766 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
ADAV | OVERALL DIAMETER | 0.240 INCHES NOMINAL ALL SEMICONDUCTOR DEVICE DIODE |
AFZC | FUNCTION FOR WHICH DESIGNED | MIXER |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT ALL SEMICONDUCTOR DEVICE DIODE |
ASCQ | INTERNAL JUNCTION CONFIGURATION | PN ALL SEMICONDUCTOR DEVICE DIODE |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE |
FEAT | SPECIAL FEATURES | EACH DIODE HAS A REMOVABLE BASE |
TTQY | TERMINAL TYPE AND QUANTITY | 2 FERRULE ALL SEMICONDUCTOR DEVICE DIODE |
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