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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-356-6553 Item Description: Microcircuit Assemb | 5962 | 013566553 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
205-0059-001 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | RAM |
205-00-25K | 205-00-501 | 205.000.001 | 205-00-503 |
205-00-5K | 205-00-20K | 205-00-25K | 205-00-501 |
205 00 10K | 205.000.001 | 205-00-5K | 205-00-503 |
205 0 6WDUAL | 205-00-501 | 205-00-50K | 205-00-50K |
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