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| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 2.096 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.620 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/CLOCK AND W/BUFFERED OUTPUT AND BIDIRECTIONAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 27 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-5 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
| 830-005 | 830-007 | 830-002 | 830-00132 |
| 830-007 | 830-005 | 830-003 | 830-0001-01 |
| 830-0014 | 830-007 | 830-005 | 830-007 |
| 830-006 | 830-00045 | 830-005 | 830-005 |
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