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MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 2.096 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.620 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/CLOCK AND W/BUFFERED OUTPUT AND BIDIRECTIONAL |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 27 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-5 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
830-007 | 830-00132 | 830-005 | 830-00045 |
830-007 | 830-002 | 830 005 | 830-006 |
830-005 | 830-007 | 830-0001-01 | 830-00046 |
830-005 | 830-003 | 830-00034 | 830-005 |
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