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MRC | Criteria | Characteristic |
---|---|---|
AAQL | BODY STYLE | CHIP TYPE |
AARG | RELIABILITY INDICATOR | NOT ESTABLISHED |
ABJT | TERMINAL LENGTH | 0.003 INCHES MINIMUM AND 0.005 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.020 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.023 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.003 INCHES MINIMUM AND 0.005 INCHES MAXIMUM |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
CQBQ | CAPACITANCE VALUE PER SECTION | 1.000 PICOFARADS SINGLE SECTION |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
CQLZ | III TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 0.0 SINGLE SECTION |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -30.0/+30.0 SINGLE SECTION |
CRTP | TOLERANCE RANGE PER SECTION | -0.05/+0.05 PICOFARADS SINGLE SECTION |
CWJK | CASE MATERIAL | CERAMIC |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 1000000.0 MEGOHMS |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.700 |
CWSG | TERMINAL SURFACE TREATMENT | GOLD |
755-002 | 755-00073-03 | 755-00209-04 | 755-00230-01 |
755-00205-02 | 755-00187-13 | 755-00177-01 | 755-00187-13 |
755-00187-12 | 755-00231-01 | 755-00209-04 | 755-00073-02 |
755-00-28 | 755-00130-02 | 755-00205-02 | 755-00205-02 |
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