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| MRC | Criteria | Characteristic |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| ADAQ | BODY LENGTH | 1.430 INCHES MINIMUM AND 1.485 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFGA | OPERATING TEMP RANGE | -40.0 TO 85.0 DEG CELSIUS |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HIGH PERFORMANCE AND MACROLOGIC |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 135.0 DEG CELSIUS |
| MDCL | MATERIAL DOCUMENT AND CLASSIFICATION | MIL-STD-1835 MIL SPEC SINGLE MATERIAL RESPONSE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -25.0 MILLIVOLTS MINIMUM OUTPUT AND 25.0 MILLIVOLTS MAXIMUM OUTPUT |
| CQSJ | INCLOSURE MATERIAL | PLASTIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PIN |
| CZER | MEMORY DEVICE TYPE | EPROM |
| FEAT | SPECIAL FEATURES | HIGH-DENSITY AND PERFORMANCE; 32 MACROCELLS 64 EXPANDER PRODUCT TERMS IN ONE LAB; 8 DEDICATED INPUTS 16 I/O PINS; ADVANCED 0.65-MICRO CMOS EPRON TECHNOLOGY; 28-PIN 300-MIL DIP; REPLACES MULTI-CHIP TTL SOLUTIONS WHETHER SYNCHRONOUS, ASYNCHRONOUS, COMBINATORIAL, OR ALL 3 |
| CY70678506 | CY70678509 | CY70678506 | CY70678508 |
| CY70 | CY70678509 | CY70678508 | CY70678506 |
| CY70678507 | CY70678507 | CY704U | CY70832V-133AI |
| CY70678506 | CY704U | CY70678509 | CY70832V |
 |
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