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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-359-7665 Item Description: Microcircuit Memory | 5962 | 013597665 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5962-88594 | 5 | 1 | 4 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.111 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.350 INCHES MINIMUM AND 0.410 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 6625-01-260-2936 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTQX | CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM SUPPLY |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
AEHX | MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM DELAY |
CZER | MEMORY DEVICE TYPE | RAM |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 6.00 INPUT PICOFARADS MAXIMUM AND 7.00 OUTPUT PICOFARADS MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-7 MIL-M-38510 |
596-000 | 596-013 | 596-01 | 596-028 |
596.021 | 596-029 | 596-021 | 596-023 |
596-013 | 596-013 | 596-0100 | 596-028 |
596-01601-409-190 | 596-00-008-00-000465 | 596.029 | 596-00033 |
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