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MRC | Criteria | Characteristic |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K, CLOCKED AND 2 FLIP-FLOP, J-K, MASTER SLAVE |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ASYNCHRONOUS AND MONOLITHIC AND POSITIVE OUTPUTS AND W/CLEAR |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
AFGA | OPERATING TEMP RANGE | 0.0 TO 75.0 DEG CELSIUS |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 120.0 MILLIWATTS |
ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
400-00-501 | 400-00-30K | 400-00-501 | 400-00-103 |
400-00-30K | 400-00-25K | 400-00-2K | 400-000-001L000 |
400-00-2K | 400-00-102 | 400-000-002L000 | 400-00-30K |
400-00-2K | 400-000-001L999 | 400-00-103 | 400-00-253 |
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