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MRC | Criteria | Characteristic |
---|---|---|
ADAR | BODY OUTSIDE DIAMETER | 0.230 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.150 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 600.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED |
CQSJ | INCLOSURE MATERIAL | METAL |
CQSZ | INCLOSURE CONFIGURATION | CAN |
CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 REFERENCE, VOLTAGE, ANALOG |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | TO-52 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CTQX | CURRENT RATING PER CHARACTERISTIC | 1.70 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 40.0 VOLTS MAXIMUM POWER SOURCE |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 3 PIN |
SG1-02-10-10 | SG10007 | SG100-02 | SG10007 |
SG1-2-1-2 | SG1002FLR9PARENV | SG100-24 | SG100 |
SG10012 | SG10007 | SG1-02-10-10 | SG10007 |
SG1001FLR9PARENV | SG1-02-10-11 | SG100-02 | SG100-02 |
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