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MRC | Criteria | Characteristic |
---|---|---|
ADAU | BODY HEIGHT | 2.6 MILLIMETERS MINIMUM AND 4.5 MILLIMETERS MAXIMUM |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
ADAQ | BODY LENGTH | 50.8 MILLIMETERS MINIMUM AND 53.1 MILLIMETERS MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CBBL | FEATURES PROVIDED | W/CLEAR AND W/CLOCK AND HERMETICALLY SEALED |
CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
ADAT | BODY WIDTH | 13.1 MILLIMETERS MINIMUM AND 14.7 MILLIMETERS MAXIMUM |
TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
CRHL | (NON-CORE DATA) BIT QUANTITY | 8 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
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