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MRC | Criteria | Characteristic |
---|---|---|
AAQL | BODY STYLE | CHIP TYPE |
AARG | RELIABILITY INDICATOR | NOT ESTABLISHED |
ABJT | TERMINAL LENGTH | 0.002 INCHES MINIMUM AND 0.025 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.085 INCHES MINIMUM AND 0.135 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.090 INCHES MINIMUM AND 0.130 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.058 INCHES MINIMUM AND 0.102 INCHES MAXIMUM |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 100000.0 MEGOHMS |
CQBQ | CAPACITANCE VALUE PER SECTION | 33.000 PICOFARADS SINGLE SECTION |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
CQLZ | III TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 90.0 SINGLE SECTION |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 500.0 DC SINGLE SECTION |
CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -20.0/+20.0 SINGLE SECTION |
CRTP | TOLERANCE RANGE PER SECTION | -2.00/+2.00 PERCENT SINGLE SECTION |
CWJK | CASE MATERIAL | CERAMIC |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 1000000.0 MEGOHMS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
C17-02-684 | C17-0050-282 | C17-02-1102 | C17-02-684 |
C17 0050 282 | C17-0035-562 | C17-0035-123 | C17-02-1102 |
C17-02-684 | C17-0035-123 | C17-02-1103 | C17-02-1103 |
C17-00001 | C17-02-1103 | C17-02-1102 | C17-0035-212 |
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