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MRC | Criteria | Characteristic |
---|---|---|
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND BUFFER |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CQSJ | INCLOSURE MATERIAL | PLASTIC |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.255 INCHES MAXIMUM |
TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
CBBL | FEATURES PROVIDED | W/BUFFERED OUTPUT AND MONOLITHIC AND POSITIVE OUTPUTS |
ADAU | BODY HEIGHT | 0.125 INCHES MINIMUM AND 0.135 INCHES MAXIMUM |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
ADAQ | BODY LENGTH | 0.770 INCHES MAXIMUM |
ABKW | III OVERALL HEIGHT | 0.275 INCHES NOMINAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
AFGA | OPERATING TEMP RANGE | -40.0 TO 85.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
430-0-009 RE | 430-0-006 RE | 430-0-007 | 430-0-004 |
430-0-005 | 430-0-005 RE | 430-0-007 REV | 430-0-006 REV |
430-0-006 | 430-0-008 RE | 430-0-004 REV | 430-0-009 REV |
430-0-004 RE | 430-0-010 RE | 430-0-008 | 430-0-010 |
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