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| MRC | Criteria | Characteristic |
|---|---|---|
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 SHIFT REGISTER, UNIVERSAL, SHIFT STORAGE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP | INPUT CIRCUIT PATTERN | 4 INPUT AND 8 INPUT |
| TEST | TEST DATA DOCUMENT | 86360-515C3030-02 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 18.5 VOLTS MAXIMUM POWER SOURCE |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| ADAQ | BODY LENGTH | 0.400 INCHES MAXIMUM |
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